1. A variety of models meet the needs of different scenarios for mobile phone repair
2. Ma1.0: pry to remove the glue from IC and CPU
3. Ma2.0: corner knife scraping IC peripheral glue
4. Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
5. Ma4.0: prying IC hard disk
6. Ma5.0: prying CPU IC hard disk and CPU layering
7. Package includes:
2 x Knife Handle
5 x Blades
Specification:
|
Package Weight
|
| One Package Weight |
0.06kgs / 0.14lb
|
| One Package Size |
15cm * 2cm * 3cm / 5.91inch * 0.79inch * 1.18inch
|
| Carton Weight |
25.00kgs / 55.12lb
|
| Carton Size |
42cm * 32cm * 32cm / 16.54inch * 12.6inch * 12.6inch
|
| Loading Container |
20GP: 620 cartons * 400 pcs = 248000 pcs
40HQ: 1439 cartons * 400 pcs = 575600 pcs
|
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