1. Supports multiple BGA ball pitches from 0.3mm to 0.85mm, covering most mainstream IC chips and improving repair efficiency.
2. AB universal layout allows compatibility with a wide range of BGA chips, reducing the need for multiple stencils.
3. Manufactured with advanced laser cutting technology to ensure uniform hole size, accurate alignment, and consistent solder ball placement.
4. Made from high-quality stainless steel for excellent heat resistance, durability, and long-term use without deformation.
5. Polished surface prevents solder balls from sticking, enabling faster, cleaner, and more reliable reballing results.
6. Ideal for mobile phone motherboard repair, IC chip rework, PCB maintenance, and electronics repair professionals.
Specification:
|
Package Weight
|
| One Package Weight |
0.03kgs / 0.07lb
|
| One Package Size |
11cm * 10cm * 1cm / 4.33inch * 3.94inch * 0.39inch
|
| Carton Weight |
19.00kgs / 41.89lb
|
| Carton Size |
52cm * 46cm * 32cm / 20.47inch * 18.11inch * 12.6inch
|
| Loading Container |
20GP: 348 cartons * 600 pcs = 208800 pcs
40HQ: 808 cartons * 600 pcs = 484800 pcs
|
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