1. Perfectly compatible with 861DW and 861DS hot air desoldering stations, high compatibility.
2. Bent nozzle does not obstruct the view, suitable for fine-tuning repair work under a microscope.
3. Multiple nozzle diameters (4/5/6/8/10/12mm), small diameter nozzles provide concentrated and precise temperature, suitable for micro-components.
4. One-piece molded structure, direct plug-and-play installation, tight-sealed interface to prevent air leakage, stable and uniform hot air output.
5. High temperature resistant, smooth airflow channel, durable and not easily deformed, suitable for long-term motherboard repair use.
6. Suitable for desoldering and resoldering mobile phone motherboards, BGA chips, and integrated circuits.
Specification:
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Package Weight
|
| One Package Weight |
0.10kgs / 0.23lb
|
| One Package Size |
12cm * 9cm * 5cm / 4.72inch * 3.54inch * 1.97inch
|
| Carton Weight |
13.00kgs / 28.66lb
|
| Carton Size |
50cm * 47cm * 32cm / 19.69inch * 18.5inch * 12.6inch
|
| Loading Container |
20GP: 354 cartons * 120 pcs = 42480 pcs
40HQ: 823 cartons * 120 pcs = 98760 pcs
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