1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards.
2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment.
3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering.
4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls.
5. Suitable for high-volume chip refurbishment in repair shops.
6. Compact desktop design, for mobile phone repair shops and repair labs.
Specification:
|
Package Weight
|
| One Package Weight |
0.03kgs / 0.07lb
|
| One Package Size |
10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch
|
| Carton Weight |
5.80kgs / 12.79lb
|
| Carton Size |
52cm * 42cm * 42cm / 20.47inch * 16.54inch * 16.54inch
|
| Loading Container |
20GP: 290 cartons * 160 pcs = 46400 pcs
40HQ: 674 cartons * 160 pcs = 107840 pcs
|
|
