1. Crafted with high-quality 63% tin and 37% lead alloy, this solder paste delivers excellent thermal conductivity and stable melting performance, ensuring durable and reliable solder joints for BGA and SMT applications.
2. Made with halide-free materials and no harmful additives, this solder paste complies with environmental safety standards. Safe for operators and ideal for electronics repair without corrosion risks.
3. No-Clean, Low-Residue Efficiency: Minimal post-welding residue eliminates the need for cleaning, saving time and reducing workflow steps. Perfect for high-precision tasks like smartphone and PC motherboard repairs.
4. 25-45μm Micro Particles for Precision: Ultra-fine particle size (25-45μm) ensures smooth tin loading and even distribution, preventing issues like bridging, tin beads, or cold joints. Ideal for densely packed BGA chips and micro components.
5. Advanced Membrane Removal Technology: Optimizes efficiency with reduced mesh scraping during application, improving workflow speed. Enhances solder joint brightness, adhesion, and conductivity for professional-grade results.
Specification:
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Package Weight
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| One Package Weight |
0.08kgs / 0.19lb
|
| One Package Size |
10cm * 8cm * 8cm / 3.94inch * 3.15inch * 3.15inch
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| Carton Weight |
6.20kgs / 13.67lb
|
| Carton Size |
42cm * 34cm * 34cm / 16.54inch * 13.39inch * 13.39inch
|
| Loading Container |
20GP: 549 cartons * 64 pcs = 35136 pcs
40HQ: 1275 cartons * 64 pcs = 81600 pcs
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