1. High thermal conductivity design ensures rapid heating and fast temperature recovery, significantly improving soldering efficiency.
2. Precise temperature response and stable thermal control deliver consistent, reliable solder joints while minimizing cold soldering and overheating risks.
3. Multi-layer electroplated coating provides excellent oxidation and corrosion resistance, ensuring extended service life.
4. Designed for PCB boards, smartphone motherboards, and electronic component soldering, ideal for professional repair and manufacturing use.
5. Available in multiple T12 tip profiles to support precision soldering, drag soldering, and large joint applications.
Specification:
|
Package Weight
|
| One Package Weight |
0.02kgs / 0.05lb
|
| One Package Size |
17cm * 5cm * 1cm / 6.69inch * 1.97inch * 0.39inch
|
| Carton Weight |
13.00kgs / 28.66lb
|
| Carton Size |
52cm * 36cm * 32cm / 20.47inch * 14.17inch * 12.6inch
|
| Loading Container |
20GP: 445 cartons * 600 pcs = 267000 pcs
40HQ: 1033 cartons * 600 pcs = 619800 pcs
|
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