1. Suitable for mid-layer soldering on Apple/Android motherboards, enabling seamless repair and rapid spot soldering.
2. Replaces traditional wire-wound spot soldering, restoring the original appearance of the solder pads.
3. Made of high-quality phosphor bronze, with low resistance, high efficiency, and fatigue resistance.
4. Withstands repeated heating with hot air guns and soldering irons, firmly bonding to the PCB substrate and preventing detachment after rework.
5. No need for complex flying wire repairs; simply pick up with tweezers, align, and solder directly, significantly reducing repair time.
6. Package includes: Solder pad x1
Specification:
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Package Weight
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| One Package Weight |
0.02kgs / 0.05lb
|
| One Package Size |
10cm * 6cm * 1cm / 3.94inch * 2.36inch * 0.39inch
|
| Carton Weight |
21.00kgs / 46.30lb
|
| Carton Size |
52cm * 42cm * 32cm / 20.47inch * 16.54inch * 12.6inch
|
| Loading Container |
20GP: 381 cartons * 1000 pcs = 381000 pcs
40HQ: 885 cartons * 1000 pcs = 885000 pcs
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