1. High strength lightweight, precision handling, enhanced control, superior corrosion resistance, adapts to various environments
2. T3D-11 3D Ultra-Stiff Model: Designed for chip reballing and micro-flying wire operations under microscopy
3. Tia-11 Standard Model: Designed for daily electronics repair, phone disassembly, chip replacement, and general tasks
4. Tia-16 45 degrees Curved Tip Model: Angled design for flying wires, handling compact components, and precise adjustments
5. Use: Electronics assembly repair, chip debugging, ESD and contamination protection
Specification:
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Package Weight
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| One Package Weight |
0.05kgs / 0.12lb
|
| One Package Size |
18cm * 4cm * 2cm / 7.09inch * 1.57inch * 0.79inch
|
| Carton Weight |
21.00kgs / 46.30lb
|
| Carton Size |
42cm * 42cm * 38cm / 16.54inch * 16.54inch * 14.96inch
|
| Loading Container |
20GP: 397 cartons * 400 pcs = 158800 pcs
40HQ: 923 cartons * 400 pcs = 369200 pcs
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