1. Broad Model Compatibility: Engineered for safe layered motherboard desoldering on models from X through 16 Pro Max, minimizing risk to sensitive components.
2. Advanced Rapid Heating Technology: Newly upgraded heating element delivers fast temperature ramp-up and precise heat control for reliable preheating.
3. Smart Countdown & Sleep Mode: Built-in countdown timer and intelligent 15-minute standby function enhance safety and energy efficiency during idle periods.
4. Digital Temperature Display & Control: Real-time digital temperature readout allows technicians to monitor and fine-tune heat profiles accurately.
5. Uniform and Rapid Heat Transfer: Heats evenly and quickly, combined with anti-slip heavy base for stable board placement.
6. International Voltage Support: Dual-voltage compatibility makes the platform suitable for global repair environments.
Specification:
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Package Weight
|
| One Package Weight |
2.00kgs / 4.42lb
|
| One Package Size |
24cm * 18cm * 17cm / 9.45inch * 7.09inch * 6.69inch
|
| Carton Weight |
17.00kgs / 37.48lb
|
| Carton Size |
50cm * 38cm * 36cm / 19.69inch * 14.96inch * 14.17inch
|
| Loading Container |
20GP: 389 cartons * 8 pcs = 3112 pcs
40HQ: 905 cartons * 8 pcs = 7240 pcs
|
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