1. Power: 1300W
2. Input: AC110-220V, 50HZ/60HZ
3. Airflow range: 1-200
4. Temperature range: 100-550 degrees Celsius / 212-1022 degrees Fahrenheit
5. Heating core: plug-in ceramic heating core
6. Weight: about 7.85kg
7. Size: about 26 x 19 x 17.5cm
Features:
1. Suitable for SOIC, CHIP, QFP, PLCC, BGA and other original disassembly, soldering
2. 3 heating mode, four temperature air volume storage memory
3. Air flow infinitely adjustable, up to 200 levels of air output
4. Multi-function menu, three large screen intelligent digital display
5. One key to set the cold air / sound switch, temperature / air volume multiplier fast adjustment, Celsius / Fahrenheit free switching
6. 3s to warm up, 130W high power, easy to dismantle the solder melt tin
7. Pluggable heating core / handle, convenient operation
Specification:
|
Package Weight
|
| One Package Weight |
8.50kgs / 18.75lb
|
| One Package Size |
43cm * 43cm * 28cm / 16.93inch * 16.93inch * 11.02inch
|
| Carton Weight |
18.00kgs / 39.68lb
|
| Carton Size |
58cm * 44cm * 44cm / 22.83inch * 17.32inch * 17.32inch
|
| Loading Container |
20GP: 237 cartons * 2 pcs = 474 pcs
40HQ: 551 cartons * 2 pcs = 1102 pcs
|
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