1. Single roll specifications: 2.0mm wide, 1.5m long; bulk packaging for repairs, meeting daily desoldering needs.
2. Ultra-high density woven copper mesh, excellent thermal conductivity, significantly improving desoldering efficiency.
3. Quickly removes excess solder, leaving pads clean and residue-free, effectively protecting PCB pads during chip replacement.
4. Anti-fragmentation design at the head prevents the desoldering tape from unraveling, facilitating alignment with tiny solder joints, suitable for precision micro-soldering on motherboards.
5. High-quality copper braided material, formulated with flux for smooth thermal conductivity.
6. For repairing mobile phone motherboards, PCB circuit boards, and IC chips.
Specification:
|
Package Weight
|
| One Package Weight |
0.17kgs / 0.38lb
|
| One Package Size |
11cm * 6cm * 6cm / 4.33inch * 2.36inch * 2.36inch
|
| Carton Weight |
26.50kgs / 58.42lb
|
| Carton Size |
57cm * 38cm * 32cm / 22.44inch * 14.96inch * 12.6inch
|
| Loading Container |
20GP: 384 cartons * 150 pcs = 57600 pcs
40HQ: 893 cartons * 150 pcs = 133950 pcs
|
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