1. This 100PCS copper shim set is specifically designed for repairing Android smartphone CPUs, providing targeted heat dissipation after chip reballing or motherboard maintenance.
2. Precision-customized 12.4x14mm short-circuit prevention dimensions ensure full coverage of the chip surface without edge overhang, avoiding contact and short circuits with surrounding components.
3. Made of oxygen-free pure copper, significantly reducing chip temperature when used with thermal paste.
4. Three thickness options (0.1/0.3/0.5mm) available to fit different device models.
5. Replaces damaged OEM thermal materials after CPU rework, reducing the risk of device failure caused by inadequate factory-restored cooling.
Specification:
|
Package Weight
|
| One Package Weight |
0.03kgs / 0.07lb
|
| One Package Size |
10cm * 10cm * 8cm / 3.94inch * 3.94inch * 3.15inch
|
| Carton Weight |
2.70kgs / 5.95lb
|
| Carton Size |
32cm * 50cm * 32cm / 12.6inch * 19.69inch * 12.6inch
|
| Loading Container |
20GP: 520 cartons * 54 pcs = 28080 pcs
40HQ: 1209 cartons * 54 pcs = 65286 pcs
|
|
