1. Precision 0.12mm Design: Features 0.12mm pinholes, perfectly suited for iPhone 17 Series CPU BGA reballing.
2. High-Accuracy Reballing Tool: Nickel-plated steel stencil ensures precise solder ball placement, improving soldering success rates.
3. Durable Material: Made from high-quality wear-resistant steel, heat-resistant and deformation-free, suitable for repeated use.
4. Professional Repair Tool: Designed for technicians and professional repair shops, improving CPU BGA chip replacement and repair efficiency.
5. Wide Compatibility: Compatible with iPhone 17 Series CPU/BGA reballing applications.
6. Enhances Soldering Efficiency: Accurate hole placement minimizes solder ball displacement, reduces rework, and increases workflow efficiency.
Specification:
|
General
|
| Compatible with |
Apple:
iPhone 17 Pro
, iPhone Air
, iPhone 17 Pro Max
, iPhone 17
|
|
|
Package Weight
|
| One Package Weight |
0.02kgs / 0.05lb
|
| One Package Size |
11cm * 10cm * 1cm / 4.33inch * 3.94inch * 0.39inch
|
| Carton Weight |
10.00kgs / 22.05lb
|
| Carton Size |
52cm * 35cm * 32cm / 20.47inch * 13.78inch * 12.6inch
|
| Loading Container |
20GP: 457 cartons * 450 pcs = 205650 pcs
40HQ: 1062 cartons * 450 pcs = 477900 pcs
|
|
