1. Built-in strong magnet firmly secures various BGA stencils, preventing stencil shifting during soldering and ensuring precise placement.
2. Comes with a high-temperature resistant silicone pad, able to withstand high-temperature operation with a hot air gun, resistant to melting and deformation, heat-resistant and durable, suitable for long-term chip soldering repairs.
3. Arc-shaped fitting design ensures a tight fit with the stencil without gaps, reducing solder leakage and significantly improving the success rate of soldering.
4. Widely compatible with the full range of 2UUL soldering stencils, supporting CPU, IC chips, and motherboard BGA soldering, meeting various repair scenarios for mobile phone motherboards.
5. Does not occupy workbench space, easy to store and carry, suitable for repair shops and on-site repair technicians.
6. Simple disassembly and assembly, easy cleaning of solder paste residue, reusable.
Specification:
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Package Weight
|
| One Package Weight |
0.17kgs / 0.38lb
|
| One Package Size |
9cm * 7cm * 2cm / 3.54inch * 2.76inch * 0.79inch
|
| Carton Weight |
21.40kgs / 47.18lb
|
| Carton Size |
38cm * 23cm * 22cm / 14.96inch * 9.06inch * 8.66inch
|
| Loading Container |
20GP: 1386 cartons * 120 pcs = 166320 pcs
40HQ: 3219 cartons * 120 pcs = 386280 pcs
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