1. Precisely engineered to fit 12/13/14/15 and 16 series logic board repair.
2. Ensures stable alignment of chips and logic boards during reballing for higher success rates.
3. Quick replacement and secure fixation improve repair efficiency, ideal for frequent use.
4. Built with high-strength, heat-resistant alloy for long-lasting performance under repeated use.
5. Specially developed for motherboard-level IC reballing and BGA rework, meeting the needs of repair experts.
6. User-friendly design allows even less experienced technicians to work efficiently and with confidence.
Specification:
|
General
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| Compatible with |
Apple:
iPhone 16e
, iPhone 16 Pro Max
, iPhone 16 Plus
, iPhone 16
, iPhone 16 Pro
, iPhone 15
, iPhone 15 Pro Max
, iPhone 15 Pro
, iPhone 15 Plus
, iPhone 14 Plus
, iPhone 14
, iPhone 14 Pro
, iPhone 14 Pro Max
, iPhone 13 Pro Max
, iPhone 13
, iPhone 13 mini
, iPhone 13 Pro
, iPhone 12
, iPhone 12 Pro Max
, iPhone 12 Pro
, iPhone 12 mini
|
|
|
Package Weight
|
| One Package Weight |
0.45kgs / 1.00lb
|
| One Package Size |
11cm * 10cm * 7cm / 4.33inch * 3.94inch * 2.76inch
|
| Carton Weight |
28.00kgs / 61.73lb
|
| Carton Size |
42cm * 35cm * 37cm / 16.54inch * 13.78inch * 14.57inch
|
| Loading Container |
20GP: 490 cartons * 60 pcs = 29400 pcs
40HQ: 1138 cartons * 60 pcs = 68280 pcs
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