1. Professional-grade CPU and motherboard soldering fixture designed for chip-level mobile repair.
2. U-shaped high-stability structure securely holds PCB boards in place, preventing movement during repair.
3. Built from heat-resistant metal materials, suitable for hot air rework and BGA soldering applications.
4. High-precision alignment system ensures accurate positioning for improved repair success rate.
5. Anti-slip stable base minimizes vibration and enhances operational safety.
6. Compatible with various motherboard sizes, including iPhone and Android devices.
7. Ideal for CPU replacement, IC desoldering, reballing, and advanced micro soldering tasks.
Specification:
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Package Weight
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| One Package Weight |
0.20kgs / 0.45lb
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| One Package Size |
14cm * 9cm * 4cm / 5.51inch * 3.54inch * 1.57inch
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| Carton Weight |
21.00kgs / 46.30lb
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| Carton Size |
47cm * 42cm * 30cm / 18.5inch * 16.54inch * 11.81inch
|
| Loading Container |
20GP: 450 cartons * 100 pcs = 45000 pcs
40HQ: 1045 cartons * 100 pcs = 104500 pcs
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