1. Blade diameter: 2.0mm
2. High-hardness blade material, wear-resistant, long service life
3. For scraping off adhesive from mobile phone motherboards, IC chips, BGA underfill, and PCB boards
4. Specially designed safety tip prevents scratching or cutting integrated circuit chips, PCB circuit boards, and copper pads
5. Quickly removes cured adhesive, black adhesive on chips, and residual filler
6. Ergonomic non-slip handle provides a stable grip for delicate operations.
Specification:
|
Package Weight
|
| One Package Weight |
0.03kgs / 0.07lb
|
| One Package Size |
20cm * 11cm * 1cm / 7.87inch * 4.33inch * 0.39inch
|
| Carton Weight |
10.00kgs / 22.05lb
|
| Carton Size |
57cm * 42cm * 32cm / 22.44inch * 16.54inch * 12.6inch
|
| Loading Container |
20GP: 348 cartons * 300 pcs = 104400 pcs
40HQ: 808 cartons * 300 pcs = 242400 pcs
|
|
