1. Motherboard Protection Design: The ball head design effectively prevents damage to the motherboard, ensuring safety during the soldering process.
2. Made from pure copper with gold plating, offering excellent conductivity and anti-oxidation properties.
3. Uniform Tin Coating: The tin-coating process is fast and uniform, ensuring consistent soldering quality.
4. Strong Compatibility: Compatible with various phone models, catering to a diverse range of user needs.
5. High Durability: Quality materials and design extend product lifespan, reducing frequency of replacement.
Specification:
|
Package Weight
|
| One Package Weight |
0.01kgs / 0.03lb
|
| One Package Size |
7cm * 9cm * 1.5cm / 2.76inch * 3.54inch * 0.59inch
|
| Carton Weight |
6.00kgs / 13.23lb
|
| Carton Size |
47cm * 32cm * 37cm / 18.5inch * 12.6inch * 14.57inch
|
| Loading Container |
20GP: 479 cartons * 500 pcs = 239500 pcs
40HQ: 1112 cartons * 500 pcs = 556000 pcs
|
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