1. Compatible with multiple desoldering stations including 858A, 858D, 858AD, 2008, and 705, replacing original nozzles.
2. Curved nozzle does not obstruct vision, suitable for fine repair work under a microscope.
3. Straight nozzle provides excellent heat conduction and smooth airflow, meeting routine desoldering needs.
4. Available in multiple nozzle diameters (4/5/6/8/10/12mm). Small diameter nozzles provide concentrated and precise temperature control, suitable for micro-components; large diameter nozzles are suitable for large chips.
5. One-piece molded structure for direct plug-and-play installation. The interface is tightly sealed to prevent air leakage, ensuring stable and uniform hot air output.
6. Excellent thermal conductivity, smooth internal airflow, high temperature resistance, durable even after repeated high-temperature use, and long service life.
7. Suitable for desoldering and soldering operations on mobile phone motherboards, BGAs, and IC chips.
Specification:
|
Package Weight
|
| One Package Weight |
0.10kgs / 0.23lb
|
| One Package Size |
12cm * 9cm * 5cm / 4.72inch * 3.54inch * 1.97inch
|
| Carton Weight |
13.00kgs / 28.66lb
|
| Carton Size |
50cm * 47cm * 32cm / 19.69inch * 18.5inch * 12.6inch
|
| Loading Container |
20GP: 354 cartons * 120 pcs = 42480 pcs
40HQ: 823 cartons * 120 pcs = 98760 pcs
|
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