1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.
2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.
3. High-temperature resistant, suitable for hot air gun reflow soldering.
4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.
5. Compact desktop design, saving repair table space.
6. Specifically designed for Huawei Mate60 and Mate60 Pro dual-layer motherboards, effectively solving the ball placement needs of separated dual-layer motherboard interconnection pads during repair work.
Specification:
|
Package Weight
|
| One Package Weight |
0.02kgs / 0.05lb
|
| One Package Size |
10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch
|
| Carton Weight |
5.80kgs / 12.79lb
|
| Carton Size |
62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch
|
| Loading Container |
20GP: 196 cartons * 240 pcs = 47040 pcs
40HQ: 457 cartons * 240 pcs = 109680 pcs
|
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