1. Lead-free Solder Paste is a high-performance, no-clean soldering solution designed for precision electronics assembly and repair. Ideal for BGA applications, it delivers exceptional conductivity, reliability, and efficiency while minimizing post-weld residue.
2. Strong Adhesion & Extensibility: Provides robust attachment to solder joints and retains flexibility after cooling, ensuring long-term durability.
3. Advanced Membrane Removal Technology: Reduces net scraping frequency during operation, improving workflow efficiency by up to 30%.
4. No-Clean & Eco-Friendly Formula: Leaves very little residue, eliminating post-weld cleaning. High resistance ensures stability in demanding conditions.
5. Particle Size: 35-45 microns
6. Melting Point: 138 degrees Celsius
7. Recommended Temperature: 160–170 degrees Celsius
8. Net Weight: 35g
Specification:
|
Package Weight
|
| One Package Weight |
0.06kgs / 0.14lb
|
| One Package Size |
10cm * 8cm * 5cm / 3.94inch * 3.15inch * 1.97inch
|
| Carton Weight |
6.90kgs / 15.21lb
|
| Carton Size |
42cm * 34cm * 32cm / 16.54inch * 13.39inch * 12.6inch
|
| Loading Container |
20GP: 583 cartons * 9 pcs = 5247 pcs
40HQ: 1354 cartons * 9 pcs = 12186 pcs
|
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