1. Specially designed for BGA chips, smartphone motherboards, and precision PCB jump wiring, ensuring clean, compact solder joints.
2. Non-insulated bare copper structure allows for direct tinning and faster soldering, eliminating stripping steps and improving repair efficiency.
3. Made from high-purity copper with excellent conductivity and low resistance, ensuring stable and secure solder joints for high-reliability electronic repairs.
4. Highly flexible and smooth wire allows easy routing through complex paths without breaking, perfect for intricate board-level repairs.
5. Versatile conductor wire suitable for various jump wire applications including mobile phones, computer motherboards, LCD screens, and audio chip repairs.
Specification:
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Package Weight
|
| One Package Weight |
0.04kgs / 0.10lb
|
| One Package Size |
10cm * 10cm * 3cm / 3.94inch * 3.94inch * 1.18inch
|
| Carton Weight |
13.00kgs / 28.66lb
|
| Carton Size |
47cm * 42cm * 38cm / 18.5inch * 16.54inch * 14.96inch
|
| Loading Container |
20GP: 355 cartons * 400 pcs = 142000 pcs
40HQ: 825 cartons * 400 pcs = 330000 pcs
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