1. Exquisite craftsmanship, uniform/rapid, full and smooth tinning, pure copper with gold plating, quick tin absorption
2. The needle tip is made of high-purity copper with gold plating, which increases the tinning speed by 50%
3. The spherical tip design enables precise fitting to the edge of the pad, preventing scratches on the motherboard. It is particularly suitable for soldering wick operations on BGA packaged chips
4. Designed specifically for mobile phone card holders and connectors. 5. The ball tip can reach deep into gaps to quickly complete pad desoldering
6. Alloy material with ESD protection: Prevents electrostatic damage to electronic components during precision motherboard repair
7. Package includes:
1 x Solder Bar
3 x Needle
Specification:
|
Package Weight
|
| One Package Weight |
0.04kgs / 0.10lb
|
| One Package Size |
17cm * 8cm * 1cm / 6.69inch * 3.15inch * 0.39inch
|
| Carton Weight |
13.00kgs / 28.66lb
|
| Carton Size |
42cm * 36cm * 32cm / 16.54inch * 14.17inch * 12.6inch
|
| Loading Container |
20GP: 551 cartons * 300 pcs = 165300 pcs
40HQ: 1279 cartons * 300 pcs = 383700 pcs
|
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