1. A smooth, spring-loaded mechanism with parallel rails ensures zero jamming—simply press down for an instant, wobble-free hold on BGA, CPU, or IC chips. Perfect for high-pressure repairs where precision matters!
2. Built with premium materials (including 500 degrees Celsius heat-resistant glass), this clip withstands extreme heat from hot air guns or soldering stations. Keep working confidently, even in the most demanding thermal environments.
3. The 23×40mm clamping range (23mm width, 40mm depth) accommodates large BGA chips, multi-pin CPUs, and various ICs; no more struggling with oversized components! Compatible with most standard chip sizes for versatile repairs.
4. Ideal for: BGA reballing (prevents chip movement during heating); CPU/IC desoldering (secure grip for safe removal); Pin repair (stabilizes chips while fixing bent/missing pins); General PCB assembly (holds components steady for precise soldering)
5. Lightweight (125g net weight) and pocket-sized (55×98×13mm), its easy to carry in your repair toolkit.
Specification:
|
Package Weight
|
| One Package Weight |
0.20kgs / 0.45lb
|
| One Package Size |
12cm * 7cm * 2.5cm / 4.72inch * 2.76inch * 0.98inch
|
| Carton Weight |
21.00kgs / 46.30lb
|
| Carton Size |
37cm * 27cm * 26cm / 14.57inch * 10.63inch * 10.24inch
|
| Loading Container |
20GP: 1026 cartons * 100 pcs = 102600 pcs
40HQ: 2383 cartons * 100 pcs = 238300 pcs
|
|
