1. Clearly illuminates fine CPU traces, micro pads, jumpers, and solder joints, significantly improving visibility for micro-soldering and pad repair operations under a stereo microscope.
2. Built-in strong magnet securely attaches to most mainstream BGA fixtures, adhesive removal fixtures, and metal worktables.
3. Adjustable illumination angle, saving operating space.
4. Plug and play, easy to operate, providing stable and continuous illumination to meet the needs of long-term repair work.
5. Specifically designed for smartphone CPU jumper soldering, pad repair, BGA chip ball placement, and underfill adhesive removal.
6. Perfectly matches the workflow of a trinocular stereo microscope for chip-level maintenance of mobile phone motherboards.
7. Lightweight and portable, saving limited worktable space.
8. An essential auxiliary lighting tool for high-precision micro-soldering operations in professional repair workshops.
Specification:
|
Package Weight
|
| One Package Weight |
0.07kgs / 0.16lb
|
| One Package Size |
10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch
|
| Carton Weight |
9.40kgs / 20.72lb
|
| Carton Size |
52cm * 42cm * 32cm / 20.47inch * 16.54inch * 12.6inch
|
| Loading Container |
20GP: 381 cartons * 120 pcs = 45720 pcs
40HQ: 885 cartons * 120 pcs = 106200 pcs
|
|
