1. Produces strong, secure solder joints to help prevent cold solder joints and improve the reliability of electronic repairs.
2. Designed for smooth solder flow and easy tinning, helping improve soldering efficiency and streamline repair work.
3. Leaves minimal flux residue after soldering, reducing the need for additional cleaning in suitable applications.
4. Features a dual-core rosin flux structure to support consistent flux delivery during soldering.
5. Supports continuous soldering operations with smooth feeding, helping technicians work more efficiently on electronic components and circuit boards.
Specification:
|
Package Weight
|
| One Package Weight |
0.07kgs / 0.16lb
|
| One Package Size |
7cm * 7cm * 3cm / 2.76inch * 2.76inch * 1.18inch
|
| Carton Weight |
18.50kgs / 40.79lb
|
| Carton Size |
37cm * 37cm * 32cm / 14.57inch * 14.57inch * 12.6inch
|
| Loading Container |
20GP: 608 cartons * 250 pcs = 152000 pcs
40HQ: 1413 cartons * 250 pcs = 353250 pcs
|
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