1. Pure copper gold-plated needle, tinning speed increased by 50%
2. Ball head design, can go deep into the gap, quickly complete the row of pins drag tin, and not easy to scratch the motherboard
3. Containing 5 tin dragging pins, even/fast, full of tin
4. Can be easily operated in small space, not easy to scratch the inline holder
5. Suitable for motherboard maintenance tin drag, especially suitable for BGA package chip tin drag
6. Size: Handle about 11.8 x 0.8cm, Needle about 2 x 0.12cm
7. Net weight: about 21.4g
Specification:
|
Package Weight
|
| One Package Weight |
0.04kgs / 0.10lb
|
| One Package Size |
18cm * 10cm * 2cm / 7.09inch * 3.94inch * 0.79inch
|
| Carton Weight |
14.20kgs / 31.31lb
|
| Carton Size |
47cm * 36cm * 35cm / 18.5inch * 14.17inch * 13.78inch
|
| Loading Container |
20GP: 450 cartons * 330 pcs = 148500 pcs
40HQ: 1045 cartons * 330 pcs = 344850 pcs
|
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