1. Designed for L2023 intelligent desoldering platform
2. Enlarged heating area, supports motherboard repair
3. Built-in strong magnetic design for easy module replacement
4. Securely fasten the motherboard to ensure proper fit during heating
5. Modular design allows for the replacement of corresponding positioning molds, enhancing practicality for maintenance
Specification:
|
General
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| Compatible with |
Apple:
iPhone 16 Pro Max
, iPhone 16 Plus
, iPhone 16
, iPhone 16 Pro
|
|
|
Package Weight
|
| One Package Weight |
0.08kgs / 0.19lb
|
| One Package Size |
12cm * 8cm * 4cm / 4.72inch * 3.15inch * 1.57inch
|
| Carton Weight |
9.00kgs / 19.84lb
|
| Carton Size |
42cm * 42cm * 26cm / 16.54inch * 16.54inch * 10.24inch
|
| Loading Container |
20GP: 581 cartons * 100 pcs = 58100 pcs
40HQ: 1349 cartons * 100 pcs = 134900 pcs
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